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1.0. Introduction
1.1. General
1.1.1. Elements
1.2. Legacy Wi-Fi
1.2.1. 802.11b
1.2.1.1. Characteristics
1.2.1.2. Physical Layer
1.2.1.3. MAC Layer
1.2.2. Family
1.2.2.1. 802.11a
1.2.2.2. 802.11g
1.3. Scope
1.4. Details
1.5. Research Methodology
1.6. Target Audience
2.0. IEEE 802.11n
2.1. 802.11n Status
2.1.1. Environment
2.1.2. Draft v. 1.0
2.1.3. Draft v. 2.0
2.1.4. Further Developments and IEEE Approval
2.2. Wi-Fi Alliance
2.3. 802.11n Technology Specifics
2.3.1. Advances
2.3.1.1. MIMO
2.3.1.2. Spatial Division Multiplexing
2.3.1.3. OFDM
2.3.1.4. Channel Bonding
2.3.1.5. Packet Aggregation
2.3.2. PHY and MAC
2.4. Major Features: Summary
2.4.1. Specifics
2.4.2. Channel Bandwidth
2.4.3. Backward Compatibility
2.4.4. Adaptation
2.4.5. Security
2.4.6. Enhancements
2.5. Benefits and Applications
2.5.1. Benefits
2.5.2. Applications
2.6. Market
2.6.1. Drivers
2.6.2. Market Forecast
2.6.2.1. Model Assumptions
2.6.2.2. Forecast
2.7. Industry
Aerohive (APs)
Aruba (APs)
Atheros-Qualcomm (Chipsets, WUSB)
Buffalo (Router, AP)
Belkin (Routers, Adaptors, WUBS)
Broadcom (Chipsets, WUSB)
Cisco (AP)
Celeno (HDVD)
D-Link (Routers, WUSB)
Edimax (Router, WUSB Adapter)
Extreme (AP)
Marvell (Chipsets)
Meru (Family of Products, HDVD)
Motorola Solution (Tools, AP)
NEC (Router)
Netgear (Router, AP, HD streaming)
Redpine Signals (Chipsets)
Ruckus (AP, Multimedia)
Quantenna (chipsets)
TP-Link
TrendNet (Routers, AP, WUSB)
Xirrus
ZyXel (AP, Router, WUSB)
3.0. 60 GHz Wi-Fi
3.1. Goal
3.2. General
3.3. 60 GHz Band Spectrum Specifics
3.3.1. Frequencies Allocation
3.3.2. Oxygen Absorption
3.4. Antenna
3.5. Radiation Limiting at 60 GHz
3.6. Combined Effect
3.7. Progress in the Chip Technology
3.7.1. Challenges and Efforts
3.7.2. Modulation
3.7.3. Specifics
3.7.3.1. Indoor Behavior
3.8. Summary
3.9. Prospectus: 60 GHz WLAN
3.9.1. Benefits and Issues
3.9.2. WiGig Alliance
3.9.2.1. Union
3.9.3. IEEE 802.11ad - 60 GHz Wi-Fi
3.9.3.1. Status
3.9.3.2. Coexistence
3.9.3.3. Scope
3.9.3.4. Channelization
3.9.3.5. PHY
3.9.3.6. MAC
3.9.3.7. Specifics
3.9.3.8. Summary
3.10. Industry
Beam Networks
Nitero
Peraso
Wilocity
3.11. Potential Market
3.11.1. Market Drivers
3.11.2. Usage Models
3.11.3. Preliminary Market Estimate
4.0. Wi-Fi and White Spaces (white-fi)
4.1. Digital Revolution
4.2. Factors
4.3. FCC Activity
4.3.1. Super Wi-Fi Hot Spots
4.3.2. Role of Database
4.3.2.1. Specifics
4.3.3. TVBD - Details
4.3.4. First Network
4.3.5. Use
4.4. Europe: Ofcom and ECC
4.4.1. Comparison
4.5. Ecosystem
4.6. Industry Activity
4.6.1. Microsoft
4.6.2. Utility
4.7. IEEE Standards
4.7.1. IEEE 802.16h
4.7.2. IEEE 802.11af
4.7.2.1. General: Expectations - Wi-Fi on Steroids
4.7.2.2. Differences
4.7.2.3. Benefits
4.7.2.4. Specifics
4.7.2.5. Prototyping
4.7.2.6. Summary
4.7.3. IEEE 1900.4
4.7.4. IEEE 802.22
4.7.4.1. General
4.7.4.2. Progress
4.7.4.3. Overview
4.7.4.4. Physical Layer - Major Characteristics
4.7.4.5. Cognitive Functions
4.7.4.6. Summary
4.7.4.7. IEEE 802.22.1 and IEEE 802.22.2
4.7.4.8. IEEE 802.22a and IEEE 802.22b
4.7.4.9. 802.22 and Smart Grid Application
4.7.5. IEEE 802.19
4.8. ECMA Activity
4.8.1. Beginning
4.8.2. Details
4.9. Cognitive Networking Alliance (CogNeA) Standard
4.10. IETF
4.11. Market
4.12. Industry
Adaptrum
Altai
Carlson Wireless
KTS Wireless
Metric Systems
Neul
Spectrum Bridge
Telcordia
5.0. Low-power Consumption Wi-Fi
5.1. General
5.1.1. Marketing Data
5.2. Industry
Atmel
Atech
eConais
GainSpan
G2 Microsystems (Acquired by Roving Networks in 2010)
Redpine Signals
RF Monolithics
Roving Networks
ZeroG (Microchip)
6.0. IEEE 802.11ac
6.1. General
6.2. Major Features
6.3. Major Benefits
6.4. Usage Models
6.5. Industry
Broadcom
Buffalo
D-Link
Linksys
Marvel
MicroChip
Netgear
Quantenna
Redpine Signals
7.0. IEEE 802.11ah
7.1. Goal
7.2. Status
7.3. Compatibility
7.4. Details
8.0. Conclusions
List of Figures:
Figure 1: OSI and 802.11
Figure 2: 802.11n MAC
Figure 3: 802.11 Protocol Family MAC Frame Structure
Figure 4: TAM: Global Sales - Wi-Fi Chipsets ($B)
Figure 5: TAM: Global Sales - Wi-Fi Chipsets (Bill. Units)
Figure 6: TAM: Global Sales - 802.11n Chipsets ($B)
Figure 7: TAM: Global Sales - 802.11n Chipsets (Bill. Units)
Figure 8: 802.11n Market Geography
Figure 9: 60 GHz Channels
Figure 10: 60 GHz Frequencies Plan
Figure 11: Spectrum Details
Figure 12: Signal Attenuation in 60 GHz Band
Figure 13: Absorption Details
Figure 14: Bands Features Comparison
Figure 15: 802.11ad MAC
Figure 16: Summary
Figure 17: TAM: Tri-band Wi-Fi Chipsets Sales - Global (Bil. Units)
Figure 18: TAM: Global Sales Tri-band Wi-Fi Chipsets ($B)
Figure 19: TVWS Channels
Figure 20: Architecture
Figure 21: TVWS Market Structure
Figure 22: PM: Low Power Consumption Wi-Fi Chipsets Sales - Global ($B)
Figure 23: Channel Assignment
List of Tables:
Table 1: 802.11b Major Characteristics
Table 2: 802.11b Channels (GHz)
Table 3: 802.11a Modulation
Table 4: 802.11g Characteristics
Table 5: 802.11 Standards Characteristics - Draft 1.0
Table 6: 802.11n PHY
Table 7: Comparison: 802.11 Family Members Transfer Rates
Table 8: 802.11n Enhancements
Table 9: 802.11n Advantages
Table 10: 60 GHz Short-reach Radio Standardization
Table 11: Directivity
Table 12: 60 GHz Links Characteristics
Table 13: 802.11ad Major Features
Table 14: 60 GHz Wi-Fi Usage Models
Table 15: TV Channels
Table 16: Differences and Similarities
Table 17: IEEE WS-related Standards
Table 18: Major Characteristics: IEEE 802.22
Table 19: IETF Activity
Table 20: Functionalities
Table 21: Usage Models
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