1.0 Introduction
1.1 General 1.2 Scope 1.3 Research Methodology 1.4 Target Audience
2.0 General: Smart Houses
2.1 Levels 2.2 Components 2.3 Benefits
3.0 SH: Wireline ICT
3.1 PLC - HomePlug in Smart Houses 3.1.1 General 3.1.2 HomePlug Alliance 3.1.2.1 Goal 3.1.2.2 Timetable 3.1.3 HomePlug 1.0 3.1.4 HomePlug Command and Control 3.1.5 HomePlug AV 3.1.5.1 Major Features 3.1.5.2 Major Applications 3.1.5.3 HomePlug AV2 3.1.6 HomePlug GP 3.1.6.1 Applications 3.1.6.2 Specifics 3.1.6.3 Developments 3.1.6.4 ZigBee/HomePlug Smart Energy (SEP 2) 3.1.7 Advantages 3.1.8 Standard Organizations Work 3.1.8.1 IEEE 3.1.8.1.1 IEEE 1901 3.1.8.1.2 IEEE P1901.2 3.1.8.1.3 IEEE 1905.1-2013 3.1.8.2 TIA 3.1.8.3 ETSI 3.1.8.4 ITU 3.1.9 HomePlug - SH Market Segment 3.1.9.1 General 3.1.9.2 Estimation 3.1.9.3 Vendors ¡¡ActionTec ¡¡Ariane ¡¡Atheros - Qualcomm Atheros ¡¡Asoka ¡¡Broadcom ¡¡Cisco ¡¡Corinex ¡¡Devolo AG ¡¡GigaFast ¡¡Insteon ¡¡MStar ¡¡Netgear ¡¡Siemens ¡¡Sigma Design ¡¡Yitran ¡¡Zyxel 3.2 ITU G.hn - HomePNA 3.2.1 HomePNA Alliance 3.2.1.1 HomePNA: Major Characteristics 3.2.1.2 Major Benefits 3.2.2 ITU Activity 3.2.2.1 General 3.2.2.1.1 ITU Recommendation G.9960 3.2.2.1.2 ITU Recommendation G.9961 3.2.2.1.3 G.hn Details 3.2.2.2 HomeGrid Forum - ITU-T G.hn 3.2.2.3 Mixed Reaction 3.2.2.4 Acceptance 3.2.2.5 Documentation 3.2.3 Samples of Vendors ¡¡Marvell ¡¡Sigma Designs ¡¡NetSys 3.3 MOCA (Multimedia over Coax Alliance) 3.3.1 General 3.3.2 Partnerships 3.3.3 Details 3.3.3.1 MoCA 2.0 3.3.3.1.1 MOCA 2.0 Technical Highlights 3.3.3.1.2 Comparison 3.3.4 Samples of Vendors ¡¡Actioncable ¡¡Broadcom ¡¡CommScope ¡¡Entropic ¡¡Netgear
4.0 Smart House: Wireless ICT
4.1 Z-Wave 4.1.2 Z-Wave Alliance 4.1.3 Benefits 4.1.4 Details 4.1.4.1 General 4.1.4.2 Characteristics 4.1.4.2.1 ITU G.9959 (2/2012) 4.1.4.3 ZigBee and Z-Wave 4.1.5 Advanced Energy Control Framework 4.1.5.1 SH: Z-wave and Smart Metering 4.1.6 Selected Vendors ¡¡Aeon Labs ¡¡Mi Casa Verde ¡¡Sigma Designs ¡¡There 4.1.7 Pricing 4.1.8 Market Estimate: Z-wave Products for Smart Houses 4.1.8.1 Model 4.1.8.2 Results 4.2 ZigBee 4.2.1 General 4.2.2 ZigBee Foundations: IEEE 802.15.4 Radio and Alliance Specifications 4.2.2.1 General 4.2.2.2 Objectives 4.2.2.3 Specifications 4.2.2.4 Feature Sets 4.2.2.5 Application Specifics - Profiles 4.2.2.5.1 Smart Energy Profile-ICT for Smart Grid 4.2.2.5.2 Enhancements - SEP 2.0 4.2.2.5.3 Features-Energy Service Portal 4.2.2.5.4 ¡°Green¡± ZigBee 4.2.2.6 ZigBee IP 4.2.2.7 ZigBee: Major Technology Features 4.2.2.7.1 Device Types 4.2.2.7.2 Protocol Stack 4.2.2.7.2.1 Physical and MAC layers - IEEE802.15.4 4.2.2.7.2.2 Upper Layers 4.2.2.7.3 Security 4.2.2.7.4 Applications - General 4.2.2.7.4.1 Home 4.2.2.7.4.2 PC 4.2.2.7.4.3 Manufacturing 4.2.2.7.4.4 WSN-UGS and ZigBee 4.2.3 802.15.4 - ZigBee Radio 4.2.4 ZigBee Technology Benefits and Limitations 4.2.5 Market 4.2.5.1 Expectations 4.2.5.2 Segments 4.2.5.3 Forecast 4.2.5.4 Industry ¡¡Amber (RF Modules) ¡¡Atmel (Chipsets) ¡¡CEL (Modules) ¡¡Cirronet-RFM (Modules-Industrial Applications) ¡¡Digi (Radios, Routers, Energy Management) ¡¡Ember - Silicon Labs (Chipsets) ¡¡EnergyHub (Smart Home) ¡¡GreenPeak (WSN) ¡¡Freescale (Chipsets) ¡¡Libelium (Router) ¡¡Nuri Telecom (AMR Application) ¡¡NXP ¡¡Renesas Electronics (Platforms, AMR) ¡¡Silicon Laboratories (Chipsets, Modules) ¡¡Synapse (Modules, Protocols) ¡¡Telegesis (Integrator, Modules) ¡¡TI (Chipsets) 4.3 IEEE 802.15.1 (Bluetooth-BT) 4.3.1 BT Protocol Stack 4.3.1.1 Transport layer 4.3.1.1.1 Radio Layer 4.3.1.1.2 Baseband and Link Manager Layers 4.3.1.2 Middleware Layer 4.3.2 Profiles 4.3.2.1 ULP - BLE and BT Smart 4.3.3 Bluetooth Security 4.3.4 Highlights 4.3.4.1 The Standard: 4.3.4.2 The Technology: 4.3.5 Evolution 4.3.5.1 BT v2.1 4.3.5.2 BT v3.0 4.3.5.3 BT v4.0 and Up 4.3.6 Market Estimate 4.4 DECT 4.4.1 DECT - ETSI Standard 4.4.1.1 Popularity 4.4.1.2 Spectrum 4.4.1.3 Layered Structure and Major Characteristics 4.4.1.3.1 DECT in SH: Requirements 4.4.2 DECT ULE 4.4.2.1 General 4.4.2.2 Major Markets 4.4.2.3 Major Characteristics 4.4.2.3.1 Summary: ULE Advantages 4.4.2.3.2 Summary: Applications 4.4.3 DECT CAT-iq 4.4.3.1 General 4.4.3.2 Approval 4.4.3.3 Highlights 4.4.4 Market 4.4.5 Vendors Samples ¡¡Dialog Semiconductor ¡¡DSP Group ¡¡Lantiq ¡¡Mindspeed - DSP
5.0 Home Area Networks
5.1 General - Advantages 5.2 Choices 5.3 Industry Activity: Specifications 5.3.1 OpenHAN 5.3.2 U-SNAP 5.3.3 Wireless Standard 5.4 HAN Market 5.4.1 Drivers 5.4.2 Nodes 5.4.3 Geography 5.4.4 Technologies 5.4.5 Market Size 5.5 Major Players: Samples ¡¡Control4 ¡¡Insteon ¡¡NXP ¡¡Sigma Designs ¡¡SyChip
6.0 Smart Appliances
6.1 Technologies 6.1.1 LG Thinq 6.1.1.1 Details 6.1.1.2 Plans 6.1.2 Whirlpool 6.1.3 GE - 'Nucleus energy manager' and Other 6.1.3.1 ZigBee Certified 6.1.3.2 Nucleus Energy Manager 6.1.3.3 Brillion 6.2 New Standards 6.3 Market
7.0 Smart Meters
7.1 Progress 7.2 Characteristics 7.2.1 Standards Development 7.2.1.1 SMMAA 7.3 Vendors Samples ¡¡Echelon ¡¡Itron ¡¡SmartSynch 7.4 Market Characteristics
8.0 Conclusions
List Of Tables and Figures:
Figure 1: Simplified Block-diagram Figure 2: HomePlug C&C Figure 3: Advanced Features Figure 4: TAM: Global HomePlug-Equipped Products Shipped (Mil. Units) Figure 5: TAM: Global HomePlug-Equipped Products Shipped ($B) Figure 6: HomePNA - Spectrum Allocation Figure 7: TAM Estimate: U.S. Small SH Z-Wave IC ($M) Figure 8: TAM Estimate: U.S. Large SH Z-Wave IC ($US Mil) Figure 9: Profiles Figure 10: ZigBee Protocol Stack Figure 11: TAM: U.S. ZigBee Modules Sales ($B) Figure 12: TAM: U.S. ZigBee Modules Sales (Mil. Units) Figure 13: ZigBee Market Segmentation (2012) Figure 14: ZigBee Market Segmentation (2017) - Projection Figure 15 Bluetooth Protocol Stack Figure 16: Piconets Illustration Figure 17: BT ULP Layers Figure 18: TAM: Global BT Modules Shipped (Bil. Units) Figure 19: TAM: Global BT Modules Shipped ($B) Figure 20: BT Market Geographical Segmentation Figure 21: CAT-iq Development Figure 22: TAM: Global DECT ULE Equipment Shipping (Mil. Units) Figure 23: TAM: Global DECT ULE Equipment Shipping ($B) Figure 24: TAM: Global DECT CAT-iq Gateways Shipping (Mil. Units) Figure 25: TAM: Global DECT CAT-iq Gateways Shipping ($B) Figure 26: Dynamic of HAN Size Growth as Percentage of Total Deployed Figure 27: HAN Market Geography (Percentage from total market) Figure 28: HAN Radio Technologies Shares (As a percentage of total market) Figure 29: TAM: U.S. HAN Equipment Sales (Million Units) Figure 30: TAM U.S. HAN Equipment Sales ($B) Figure 31: TAM: Global Households Large Appliances ($B) Figure 32: TAM: Global Households Large Smart Appliances ($B) Figure 33: Smart Meters Development Stages Figure 34: TAM: Global Smart Meter Shipping ($B) Figure 35: TAM: Global Smart Meter Shipping (Mil. Units) Table 1: HomePlug Major Milestones Table 2: HomePlug C&C Characteristics Table 3: HomePlug AV Characteristics Table 4: HomePlug GP Features Table 5: HomePlug GP - PHY Data Table 6: HomePNA Development Table 7: ITU and HomePNA Table 8: Comparative Characteristics Table 9: Z-Wave and ZigBee Table 10: Z-wave Products Retail Pricing Table 11: ZigBee Smart Energy Profile Feature Set Table 12: ZigBee Parameters Table 13: Bluetooth Profiles Table 14: HAN IP-based (Percentage of total networks)
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