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ÇöÀçÀ§Ä¡ : HOME > ¸®Æ÷Æ® > À¯/¹«¼±Åë½Å > Ȩ³×Æ®¿öÅ©
Smart Houses ICT: Marketing and Technical Analysis
¹ßÇà»ç PracTel

¹ßÇàÀÏ 2013-09
ºÐ·® 218 pages
¼­ºñ½ºÇüÅ Report
ÆǸŰ¡°Ý

ÀμâÇϱâ

1.0 Introduction

1.1 General
1.2 Scope
1.3 Research Methodology
1.4 Target Audience

2.0 General: Smart Houses

2.1 Levels
2.2 Components
2.3 Benefits

3.0 SH: Wireline ICT

3.1 PLC - HomePlug in Smart Houses
3.1.1 General
3.1.2 HomePlug Alliance
3.1.2.1 Goal
3.1.2.2 Timetable
3.1.3 HomePlug 1.0
3.1.4 HomePlug Command and Control
3.1.5 HomePlug AV
3.1.5.1 Major Features
3.1.5.2 Major Applications
3.1.5.3 HomePlug AV2
3.1.6 HomePlug GP
3.1.6.1 Applications
3.1.6.2 Specifics
3.1.6.3 Developments
3.1.6.4 ZigBee/HomePlug Smart Energy (SEP 2)
3.1.7 Advantages
3.1.8 Standard Organizations Work
3.1.8.1 IEEE
3.1.8.1.1 IEEE 1901
3.1.8.1.2 IEEE P1901.2
3.1.8.1.3 IEEE 1905.1-2013
3.1.8.2 TIA
3.1.8.3 ETSI
3.1.8.4 ITU
3.1.9 HomePlug - SH Market Segment
3.1.9.1 General
3.1.9.2 Estimation
3.1.9.3 Vendors
¡¡ActionTec
¡¡Ariane
¡¡Atheros - Qualcomm Atheros
¡¡Asoka
¡¡Broadcom
¡¡Cisco
¡¡Corinex
¡¡Devolo AG
¡¡GigaFast
¡¡Insteon
¡¡MStar
¡¡Netgear
¡¡Siemens
¡¡Sigma Design
¡¡Yitran
¡¡Zyxel
3.2 ITU G.hn - HomePNA
3.2.1 HomePNA Alliance
3.2.1.1 HomePNA: Major Characteristics
3.2.1.2 Major Benefits
3.2.2 ITU Activity
3.2.2.1 General
3.2.2.1.1 ITU Recommendation G.9960
3.2.2.1.2 ITU Recommendation G.9961
3.2.2.1.3 G.hn Details
3.2.2.2 HomeGrid Forum - ITU-T G.hn
3.2.2.3 Mixed Reaction
3.2.2.4 Acceptance
3.2.2.5 Documentation
3.2.3 Samples of Vendors
¡¡Marvell
¡¡Sigma Designs
¡¡NetSys
3.3 MOCA (Multimedia over Coax Alliance)
3.3.1 General
3.3.2 Partnerships
3.3.3 Details
3.3.3.1 MoCA 2.0
3.3.3.1.1 MOCA 2.0 Technical Highlights
3.3.3.1.2 Comparison
3.3.4 Samples of Vendors
¡¡Actioncable
¡¡Broadcom
¡¡CommScope
¡¡Entropic
¡¡Netgear

4.0 Smart House: Wireless ICT

4.1 Z-Wave
4.1.2 Z-Wave Alliance
4.1.3 Benefits
4.1.4 Details
4.1.4.1 General
4.1.4.2 Characteristics
4.1.4.2.1 ITU G.9959 (2/2012)
4.1.4.3 ZigBee and Z-Wave
4.1.5 Advanced Energy Control Framework
4.1.5.1 SH: Z-wave and Smart Metering
4.1.6 Selected Vendors
¡¡Aeon Labs
¡¡Mi Casa Verde
¡¡Sigma Designs
¡¡There
4.1.7 Pricing
4.1.8 Market Estimate: Z-wave Products for Smart Houses
4.1.8.1 Model
4.1.8.2 Results
4.2 ZigBee
4.2.1 General
4.2.2 ZigBee Foundations: IEEE 802.15.4 Radio and Alliance Specifications
4.2.2.1 General
4.2.2.2 Objectives
4.2.2.3 Specifications
4.2.2.4 Feature Sets
4.2.2.5 Application Specifics - Profiles
4.2.2.5.1 Smart Energy Profile-ICT for Smart Grid
4.2.2.5.2 Enhancements - SEP 2.0
4.2.2.5.3 Features-Energy Service Portal
4.2.2.5.4 ¡°Green¡± ZigBee
4.2.2.6 ZigBee IP
4.2.2.7 ZigBee: Major Technology Features
4.2.2.7.1 Device Types
4.2.2.7.2 Protocol Stack
4.2.2.7.2.1 Physical and MAC layers - IEEE802.15.4
4.2.2.7.2.2 Upper Layers
4.2.2.7.3 Security
4.2.2.7.4 Applications - General
4.2.2.7.4.1 Home
4.2.2.7.4.2 PC
4.2.2.7.4.3 Manufacturing
4.2.2.7.4.4 WSN-UGS and ZigBee
4.2.3 802.15.4 - ZigBee Radio
4.2.4 ZigBee Technology Benefits and Limitations
4.2.5 Market
4.2.5.1 Expectations
4.2.5.2 Segments
4.2.5.3 Forecast
4.2.5.4 Industry
¡¡Amber (RF Modules)
¡¡Atmel (Chipsets)
¡¡CEL (Modules)
¡¡Cirronet-RFM (Modules-Industrial Applications)
¡¡Digi (Radios, Routers, Energy Management)
¡¡Ember - Silicon Labs (Chipsets)
¡¡EnergyHub (Smart Home)
¡¡GreenPeak (WSN)
¡¡Freescale (Chipsets)
¡¡Libelium (Router)
¡¡Nuri Telecom (AMR Application)
¡¡NXP
¡¡Renesas Electronics (Platforms, AMR)
¡¡Silicon Laboratories (Chipsets, Modules)
¡¡Synapse (Modules, Protocols)
¡¡Telegesis (Integrator, Modules)
¡¡TI (Chipsets)
4.3 IEEE 802.15.1 (Bluetooth-BT)
4.3.1 BT Protocol Stack
4.3.1.1 Transport layer
4.3.1.1.1 Radio Layer
4.3.1.1.2 Baseband and Link Manager Layers
4.3.1.2 Middleware Layer
4.3.2 Profiles
4.3.2.1 ULP - BLE and BT Smart
4.3.3 Bluetooth Security
4.3.4 Highlights
4.3.4.1 The Standard:
4.3.4.2 The Technology:
4.3.5 Evolution
4.3.5.1 BT v2.1
4.3.5.2 BT v3.0
4.3.5.3 BT v4.0 and Up
4.3.6 Market Estimate
4.4 DECT
4.4.1 DECT - ETSI Standard
4.4.1.1 Popularity
4.4.1.2 Spectrum
4.4.1.3 Layered Structure and Major Characteristics
4.4.1.3.1 DECT in SH: Requirements
4.4.2 DECT ULE
4.4.2.1 General
4.4.2.2 Major Markets
4.4.2.3 Major Characteristics
4.4.2.3.1 Summary: ULE Advantages
4.4.2.3.2 Summary: Applications
4.4.3 DECT CAT-iq
4.4.3.1 General
4.4.3.2 Approval
4.4.3.3 Highlights
4.4.4 Market
4.4.5 Vendors Samples
¡¡Dialog Semiconductor
¡¡DSP Group
¡¡Lantiq
¡¡Mindspeed - DSP

5.0 Home Area Networks

5.1 General - Advantages
5.2 Choices
5.3 Industry Activity: Specifications
5.3.1 OpenHAN
5.3.2 U-SNAP
5.3.3 Wireless Standard
5.4 HAN Market
5.4.1 Drivers
5.4.2 Nodes
5.4.3 Geography
5.4.4 Technologies
5.4.5 Market Size
5.5 Major Players: Samples
¡¡Control4
¡¡Insteon
¡¡NXP
¡¡Sigma Designs
¡¡SyChip

6.0 Smart Appliances

6.1 Technologies
6.1.1 LG Thinq
6.1.1.1 Details
6.1.1.2 Plans
6.1.2 Whirlpool
6.1.3 GE - 'Nucleus energy manager' and Other
6.1.3.1 ZigBee Certified
6.1.3.2 Nucleus Energy Manager
6.1.3.3 Brillion
6.2 New Standards
6.3 Market

7.0 Smart Meters

7.1 Progress
7.2 Characteristics
7.2.1 Standards Development
7.2.1.1 SMMAA
7.3 Vendors Samples
¡¡Echelon
¡¡Itron
¡¡SmartSynch
7.4 Market Characteristics

8.0 Conclusions


List Of Tables and Figures:

Figure 1: Simplified Block-diagram
Figure 2: HomePlug C&C
Figure 3: Advanced Features
Figure 4: TAM: Global HomePlug-Equipped Products Shipped (Mil. Units)
Figure 5: TAM: Global HomePlug-Equipped Products Shipped ($B)
Figure 6: HomePNA - Spectrum Allocation
Figure 7: TAM Estimate: U.S. Small SH Z-Wave IC ($M)
Figure 8: TAM Estimate: U.S. Large SH Z-Wave IC ($US Mil)
Figure 9: Profiles
Figure 10: ZigBee Protocol Stack
Figure 11: TAM: U.S. ZigBee Modules Sales ($B)
Figure 12: TAM: U.S. ZigBee Modules Sales (Mil. Units)
Figure 13: ZigBee Market Segmentation (2012)
Figure 14: ZigBee Market Segmentation (2017) - Projection
Figure 15 Bluetooth Protocol Stack
Figure 16: Piconets Illustration
Figure 17: BT ULP Layers
Figure 18: TAM: Global BT Modules Shipped (Bil. Units)
Figure 19: TAM: Global BT Modules Shipped ($B)
Figure 20: BT Market Geographical Segmentation
Figure 21: CAT-iq Development
Figure 22: TAM: Global DECT ULE Equipment Shipping (Mil. Units)
Figure 23: TAM: Global DECT ULE Equipment Shipping ($B)
Figure 24: TAM: Global DECT CAT-iq Gateways Shipping (Mil. Units)
Figure 25: TAM: Global DECT CAT-iq Gateways Shipping ($B)
Figure 26: Dynamic of HAN Size Growth as Percentage of Total Deployed
Figure 27: HAN Market Geography (Percentage from total market)
Figure 28: HAN Radio Technologies Shares (As a percentage of total market)
Figure 29: TAM: U.S. HAN Equipment Sales (Million Units)
Figure 30: TAM U.S. HAN Equipment Sales ($B)
Figure 31: TAM: Global Households Large Appliances ($B)
Figure 32: TAM: Global Households Large Smart Appliances ($B)
Figure 33: Smart Meters Development Stages
Figure 34: TAM: Global Smart Meter Shipping ($B)
Figure 35: TAM: Global Smart Meter Shipping (Mil. Units)
Table 1: HomePlug Major Milestones
Table 2: HomePlug C&C Characteristics
Table 3: HomePlug AV Characteristics
Table 4: HomePlug GP Features
Table 5: HomePlug GP - PHY Data
Table 6: HomePNA Development
Table 7: ITU and HomePNA
Table 8: Comparative Characteristics
Table 9: Z-Wave and ZigBee
Table 10: Z-wave Products Retail Pricing
Table 11: ZigBee Smart Energy Profile Feature Set
Table 12: ZigBee Parameters
Table 13: Bluetooth Profiles
Table 14: HAN IP-based (Percentage of total networks)


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