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현재위치 : HOME > 리포트 > 전기/전자 > 전자부품
Printing Equipment for Printed Electronics 2014-2025
발행사 IDTechEx

발행일 2014-05
분량 199 pages
서비스형태 Report
판매가격

인쇄하기
1. EXECUTIVE SUMMARY AND CONCLUSIONS

1.1. Comparison of Printing Technologies
1.1.1. Output performance comparison
1.1.2. Running performance comparison
1.1.3. Printing Type by Application
1.1.4. Value chain for equipment for printed electronics
1.1.5. Profitability
1.1.6. Opportunities - Component Attach


2. INTRODUCTION

2.1. What is printed electronics

2.2. Why printing?

2.3. Types of Printed electronics technologies/components

2.4. Market size of printed electronics 2014-2025

2.5. Printing Technologies


3. PRINTED ELECTRONICS MARKET

3.1. Crystalline Silicon Photovoltaics

3.2. Thin Film Photovoltaics

3.3. Touch screens

3.4. Logic and memory

3.5. OLED displays and lighting

3.6. Smart Packaging

3.7. Transparent Conductive Films

3.8. Direct Printing


4. SCREEN PRINTING

4.1. Introduction

4.2. Suitability to different devices/ components

4.3. Existing uses

4.4. Future uses

4.5. Innovation and technical progress
4.5.1. Resolution
4.5.2. Print on print (Double print)

4.6. Company profiles
4.6.1. A&M Kinzel Siebdruckmaschinen Ltd
4.6.2. Applied Materials Baccini
4.6.3. Asada Mesh
4.6.4. DEK Printing Machines Ltd
4.6.5. Dynamesh
4.6.6. Ever Bright Printing Machine Fty. Ltd
4.6.7. KIWO
4.6.8. Metal Etch Services Inc
4.6.9. p-tec GmbH
4.6.10. Saati Americas Corp
4.6.11. Sefar
4.6.12. Spartanics
4.6.13. SPGprints
4.6.14. Thieme Corporation
4.6.15. Thieme GmbH & Co KG
4.6.16. Ulano
4.6.17. UTZ Technologies
4.6.18. Werner Kammann Maschinenfabrik GmbH & Co. KG


5. INKJET PRINTING

5.1. Introduction

5.2. Suitability to different devices/ components

5.3. Existing uses

5.4. Future uses
5.4.1. Printed interconnects
5.4.2. Mass customization
5.4.3. OLED and flat panel displays, OLED lighting, Touch screens, OPV
5.4.4. Touch panel bezels
5.4.5. Masking followed by plating
5.4.6. PV bus bars and fingers

5.5. Company profiles
5.5.1. Ceradrop
5.5.2. Fujifilm Dimatix
5.5.3. Meyer Burger PixDro
5.5.4. Optomec
5.5.5. Samsung Electro-Mechanics
5.5.6. Seiko Epson
5.5.7. Sonoplot
5.5.8. THG Inkjet
5.5.9. Unijet
5.5.10. Xaar


6. FLEXO PRINTING

6.1. Introduction

6.2. Suitability to different devices/ components

6.3. Existing uses

6.4. Future uses

6.5. Company profiles
6.5.1. Gallus
6.5.2. Harper Corporation
6.5.3. Mark Andy
6.5.4. Multi Print Systems (MPS)
6.5.5. Nilpeter
6.5.6. Omet Varyflex


7. GRAVURE PRINTING

7.1. Introduction

7.2. Suitability to different devices/ components

7.3. Existing uses

7.4. Future uses

7.5. Company profiles
7.5.1. Bobst Group
7.5.2. Chestnut Engineering
7.5.3. Comco
7.5.4. Harper Corporation
7.5.5. Komori
7.5.6. Mirwec Film
7.5.7. Nilpeter
7.5.8. Ohio Gravure Technologies Accupress


8. OTHER PRINTING TYPES

8.1. Nano imprinting/embossing
8.1.1. Target applications
8.1.2. PragmatIC Printing
8.1.3. TNO

8.2. Transfer printing
8.2.1. Target applications
8.2.2. Semprius


9. COATING SYSTEMS: SLOT DIE AND ALTERNATIVES

9.1. Coating systems

9.2. Target Applications

9.3. Company profiles
9.3.1. Coatema
9.3.2. MegTec
9.3.3. Mitsubishi Materials Corporation
9.3.4. Ntact


10. POST PRINTING PROCESSING

10.1. Thermal drying

10.2. IR and UV curing

10.3. Photonic curing
10.3.1. Adphos
10.3.2. Heraeus Noblelight
10.3.3. Novacentrix
10.3.4. Xenon Corporation


11. EQUIPMENT INTEGRATION, HANDLING

11.1.1. 3D Micromac
11.1.2. Aixtron
11.1.3. Applied Laser Engineering ALE
11.1.4. Beneq
11.1.5. Bosch Rexroth
11.1.6. DP Patterning
11.1.7. InkTec
11.1.8. Kimoto Tech
11.1.9. Kroenert
11.1.10. Martin Automatic
11.1.11. Mekoprint A/S
11.1.12. Nordson Asymtek
11.1.13. Northfield Automation Systems
11.1.14. Notion Systems
11.1.15. Owens Design
11.1.16. Rolith, Inc.
11.1.17. Sempa Systems GmbH
11.1.18. Soligie
11.1.19. TDK-Lambda
11.1.20. Teknek Ltd.
11.1.21. VDL FLOW
11.1.22. Von Ardenne
11.1.23. Vinci Technologies
11.1.24. Werner Kammann Maschinenfabrik GmbH & Co. KG
11.1.25. Xymox


12. GOVERNMENT FUNDED CENTERS

12.1.1. Acreo, Sweden
12.1.2. CEA, France
12.1.3. Cetemmsa, Spain
12.1.4. CPI, UK
12.1.5. CSEM, Switzerland
12.1.6. Flexible Display Center, Arizona, USA
12.1.7. Holst Center (TNO, IMEC, Dutch Ministry of Economy Affairs, Government of Flanders), The Netherlands
12.1.8. ITRI, Taiwan
12.1.9. NRC
12.1.10. Printable Electronics Research Center, China
12.1.11. The Thailand Organic and Printed Electronics Center (TOPIC), Thailand
12.1.12. VTT

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