1.1. Conductive inks and paste: everything is changing
1.2. Traditional Markets
1.2.1. Photovoltaics
1.2.2. Touch screen market
1.2.3. Automotive
1.2.4. Sensors
1.3. RFID
1.4. Emerging applications
1.4.1. 3D antennas
1.4.2. ITO replacement
1.4.3. Stretchable inks
1.4.4. Desktop PCB printing
1.4.5. 3D Printed Electronics
2. CONDUCTIVE INKS AND PASTES
2.1. PTF vs Firing Paste
2.2. Curing and sintering
2.3. Value chain
2.4. Silver nanoparticle inks
2.5. Silver nanoparticle inks are more conducting
2.6. Curing temperature of silver nanoparticle inks
2.6.1. Enhanced Flexibility
2.6.2. Inkjet Printability
2.7. Price competiveness of silver nanoparticles
2.8. Performance of silver nanoparticle
2.9. Value chain
3. SILVER NANOPARTICLE PRODUCTION METHODS
4. COPPER INKS AND PASTE
4.1. Methods of preventing copper oxidisation
4.1.1. Superheated steam
4.1.2. Reactive agent metallization
4.1.3. Photocuring and photosintering
4.2. Pricing strategy and performance of copper inks and pastes
4.3. Copper oxide nanoparticles
4.4. Silver-Coated Copper
5. CONDUCTIVE PASTES IN THE PHOTOVOLTAIC MARKET
5.1. Background to the PV industry
5.2. Conductive pastes in the PV sectors
5.3. Alternative and improved metallization techniques
5.4. Silicon inks
5.5. Trends and changes in solar cell architecture
5.6. Market dynamics
5.7. Ten-year market forecasts for conductive paste in solar cells
6. AUTOMOTIVE
6.1. De-misters or de-foggers
6.2. Car seat heaters
6.3. Seat sensors
7. 3D PRINTED ELECTRONICS
7.1. Progress in 3D printed electronics
7.1.1. Nascent Objects
7.1.2. Voxel8
7.1.3. nScrypt ad Novacentrix
7.2. University of Texas at El Paso (UTEP)
7.3. Ten-year market projections for conductive inks and pastes in 3D printed electronics
8. TOUCH PANEL EDGE ELECTRODES
8.1. Narrow bezels change the market
8.2. Ten-year market projections for conductive inks and paste in the touch screen industry
9. CONDUCTIVE INKS IN RFID
9.1. RFID market size and business dynamics
9.2. Processes, Material Options and Market Shares
9.3. Market projections
10. PRINTED AND FLEXIBLE SENSORS
10.1. Piezoresistive
10.2. Glucose sensors
11. 3D ANTENNAS AND CONFORMAL PRINTING ON CURVED SURFACES
11.1. Laser Direct Structuring and MID
11.2. Aerosol deposition
11.3. Others ways of printing structurally-integrated antennas
11.4. Market projections for printed 3D antennas
12. THERMOFORMED OR IN-MOULD ELECTRONICS
12.1. Automotive
12.2. Ink requirements in in-mould electronics
12.3. Other materials used in in-mould electronics
12.4. In mould electronics in consumer electronics
13. STRETCHABLE INKS FOR ELECTRONIC TEXTILES
13.1. Electronic textile industry
13.2. Stretchable inks and products
13.3. Applications and ten-year market projections market forecast
14. PRINTED CIRCUIT BOARD MANUFACTURING AND PROTOTYPING
14.1. Background to the PCB industry
14.2. ‘Printing' PCBs for the hobbyist and DIY market
14.2.1. Comments
14.3. 'Printing' professional multi-layer PCBs
14.4. Comparison of different PCB techniques
15. ITO REPLACEMENT (TRANSPARENT CONDUCTING FILMS)
15.1. Market forecast for transparent conductive films
15.2. Changing market requirements
15.3. A brutal consolidation sets in
15.4. Progress and opportunities for conductive inks
15.4.1. Embossing followed by silver nanoparticle printing
15.4.2. Self-assembled silver nanoparticle films
15.4.3. Inkjet printed silver nanoparticles as transparent conducting films
15.5. Market Projections
16. CONDUCTIVE PENS
16.1. Mobile phone digitizers- first high-volume market for silver nanoparticle inks?
16.2. OLED Lighting market dynamics and challenges
16.3. OLED lighting in search of a unique
16.4. Cost projections of OLED lighting
16.5. OLED lighting market forecast
16.6. Requirements from conductive inks in OLED lighting
16.7. Market projections
17. COMPANY INTERVIEWS
17.1. Agfa-Gevaert N.V.
17.2. AgIC
17.3. Bando Chemical Industries
17.4. BeBop Sensors
17.5. BotFactory
17.6. Cartesian Co
17.7. Cima NanoTech Inc
17.8. Clariant Produkte (Deutschland) GmbH
17.9. ClearJet Ltd
17.10. Colloidal Ink Co., Ltd
17.11. Conductive Compounds
17.12. Daicel Corporation
17.13. DuPont
17.14. DuPont Advanced Materials
17.15. Electroninks Writeables
17.16. Flexbright Oy
17.17. Fujikura Kasei Co Ltd
17.18. Genes 'Ink
17.19. Henkel
17.20. Hicel Co Ltd
17.21. Inkron
17.22. InkTec Co., Ltd
17.23. Intrinsiq Materials
17.24. Komori Corporation
17.25. KunShan Hisense Electronics
17.26. Lord Corp
17.27. Methode Electronics
17.28. Nagase America Corporation
17.29. NanoComposix
17.30. Nano Dimension
17.31. NANOGAP
17.32. Novacentrix
17.33. O-film Tech Co., Ltd
17.34. Optomec
17.35. Perpetuus Carbon Technologies Limited
17.36. Printechnologics
17.37. Promethean Particles
17.38. Pulse Electronics
17.39. PV Nano Cell
17.40. Raymor Industries Inc
17.41. Showa Denko
17.42. Sun Chemical
17.43. Tangio Printed Electronics
17.44. The Sixth Element
17.45. T-Ink
17.46. Toda Kogyo Corp
17.47. Tokusen USA Inc.
17.48. Ulvac Corporation
17.49. UT Dots Inc
17.50. Vorbeck Materials
17.51. Voxel8
17.52. Xerox Research Centre of Canada (XRCC)
17.53. Xymox Technologies
18. COMPANY PROFILES
18.1. Advanced Nano Products
18.2. AIST and NAPRA
18.3. Amogreentech
18.4. Applied Nanotech Inc.
18.5. Asahi Glass Corporation
18.6. Asahi Kasei
18.7. Cabot
18.8. Chang Sung Corporation
18.9. Cima Nanotech
18.10. Ferro
18.11. Giga Solar Materials Corp
18.12. Harima
18.13. Hitachi Chemical
18.14. Kishu Giken Kogyo Co.,Ltd.
18.15. Liquid X Printed Metals, Inc.
18.16. Indium Corporation
18.17. NanoMas Technologies
18.18. Noritake
18.19. Novacentrix
18.20. Novacentrix PulseForge
18.21. Samsung (former Cheil Industries)
18.22. Taiyo
18.23. Toyobo
18.24. Vorbeck
IDTECHEX RESEARCH REPORTS AND CONSULTANCY
TABLES
2.1. These tables show the performance and processing conditions of screen-printable silver pastes.
2.2. Table listing the key suppliers of metallic powders/flakes and conductive inks/paste.
2.3. Performance and typical characteristics of various silver nanoparticle inks on the market.
2.4. List of silver nanoparticle suppliers.
4.2. List of companies supplying or researching copper or silver alloy powders, inks or pastes.
4.3. The performance and key characteristics of copper inks and pastes offered by different companies
9.1. Table outlining the operational frequency and main features of each RFID tag.
9.2. Average sales price of passive RFID tags in USD cents
18.1. Screen Printable Silver Paste
18.2. Other Silver Pastes
18.3. Inkjet Printable Inks
18.4. Applied Nanotech products
18.5. Ferro's metal products
18.6. Outline of Noritake product list
18.7. Silver and carbon pastes offered by Toyobo
18.8. Performance of Hitachi Chemical's inks compared to printed circuit board solutions
FIGURES
1.1. Ten-year market forecasts in USD for all conductive inks and pastes split by application
1.2. Ten-year market forecasts in USD for all conductive inks and pastes split by application. PV excluded.
1.3. Ten-year market forecasts for conductive inks and pastes in touch screens
1.4. Ten-year market forecasts for se conductive inks and pastes in the automotive sector as de-foggers, seat heaters and occupancy sensors.
1.5. Ten-year market forecasts for se conductive inks and pastes as piezoresistive and glucose sensors.
1.6. Conductive inks and pastes used in printing UHF RFID antennas in value and tonne
1.7. Conductive inks and pastes used in printing HF RFID antennas in value and tonne
1.8. Ten-year market forecasts for conductive inks and pastes in 3D antennas
1.9. Ten-year market forecasts for IME conductive inks and pastes in the automotive sector
1.10. Ten-year market forecasts for conductive inks and pastes in ITO replacement
1.11. Ten-year market forecasts for stretchable conductive inks and pastes in e-textiles
1.12. Ten-year market forecasts for stretchable conductive inks and pastes in 3D printed electronics.
2.1. Different morphologies of micron-sized silver particulates used in conductive paste/ink making
2.2. The process flow for making a conductive pastes.
2.3. These charts show the curing behaviour of PTFTs using a box oven and UV heater.
2.4. These charts show a typical firing profile for firing-type conductive pastes.
2.5. Typical equipment used in curing silver PTFs
2.6. A roll-to-roll photosintering machine by Novacentrix
2.7. A Xenon photosetting machine as well as its lamp
2.8. This images show SEM images of flake and spherical Ag pastes after heat and photo curing.
2.9. Images comparing the packing of flake-based and nanoparticle-based conductive lines.
2.10. Conductivity values of different sputtered and printed conductive materials.
2.11. This measured data shows that silver nanoparticle inks can form lines that are both thinner and more conducting.
2.12. Melting temperature as a function of gold particle size
2.13. Current and projected roadmap for the curing temperature and resistivity level of silver nanoparticle inks.
2.14. Data showing the thermal curing behaviour of silver nanoparticle inks. It is observed that silver nanoparticle inks require curing temperatures comparable to PTF pastes.
4.1. Spot price of silver as a function of year
4.2. The annealing method is a key step in creating conductive tracks from copper.
4.3. Apparatus and process for curing printed copper lines using Toyobo's superheated steam.
4.4. Creative copper conductive traces using reactive agent metallization
4.5. Various photosintering machines
4.6. Comparing an ideal silver-coated copper vs the ones typically produced.
5.1. Left: price history of silicon PV cells. Right: price levels and production volumes of crystalline silicon PV. The price levels are now around 30 cents per watt or less.
5.2. List of companies that went bankrupt, closed, restructured or sold equity at discount prices during the consolidation period.
5.3. Shipped production for the top 10 suppliers of solar cells.
5.4. The industry has dramatically changed over the years. US Japan and Europe have lost their leading positions at various times whereas Japan has risen.
5.5. Comparing production volumes, measured in megawatts, of different solar cells technologies in 2013(red bars) and 2014 (blue bars).
5.6. Cost breakdown of a typical wafer-based silicon solar cells.
5.7. The cost of silver conductive paste as an overall portion of the energy-generation cost of a silicon PV (in cents per watt peak) as a function of time.
5.8. Screen printed conductive lines on a typical wafer-based silicon PV.
5.9. The production process for a silicon PV showing when metallization and curing (firing) takes place
5.10. Typical curing profile of firing-type conductive pastes used in the photovoltaic industry.
5.11. Silver content per cell as a function of time. These are IDTechEx projections and underpin our market forecasts
5.12. The reduction in the silver content is made by possible by innovation in inks.
5.13. Survey results showing what the industry expected in the next decade
5.14. Predicted trend for minimum as-cut wafer thickness
5.15. Benefits of a silicon ink in improving solar cell efficiency
5.16. Current efficiency of select commercial PV modules.
5.17. Market share of different silicon solar cell architectures/technologies
5.18. Comparing the BSF and PERC cell architecture
6.1. Existing and emerging use cases of conductive inks in the interior and exterior of cars
6.2. Comparing the performance of a standard conductive paste as a de-froster when deposited on a PC and a glass substrate.
6.3. Ten-year market forecast for conductive paste used in de-foggers
6.4. Structure of a typical printed seat heater
6.5. Resistance vs temperature behaviour of a PTF carbon ink
6.6. Ten-year market forecasts for the use of conductive inks (carbon plus silver) in car seat heaters
6.7. Operation of a FSR
6.8. Response curve of a typical FSR from IEE. Product name: CP 149 Sensor
6.9. Examples of FSR individual sensors from IEE
6.10. Ten-year market forecasts for the use of conductive inks and pastes as occupancy sensors in cars.
7.1. Ten-year market projections for 3D printing materials split by SLA/DLP, extrusion, metal powder, binder jetting, etc.
7.2. Plastic filaments used in 3D printing and suppliers thereof
7.3. Plastic powders used in 3D printing and suppliers therefore
7.4. Examples of embedded and metallized 3D printed objects.
7.5. Nascent Objects seeks to modularize electronic components so that they can placed inside 3D printed objects and upgraded (exchanged) when new versions arrive
7.6. A Voxel8 3D printed electronics machine
7.7. A 3D printed electronics object with embedded circuitry
7.8. A 3D printed quadcopter with 3D printed embedded circuit
7.9. (Left) Photonically-cured copper in and (right) nScrypt's patented SmartPump
7.10. 3D printed electronics objects by University of Texas
7.11. IDTechEx market forecasts for conductive inks and pastes
8.1. Schematic of a touch screen system and a close-up of printed edge electrodes
8.2. Table showing the linewidth resolution of various processes used in making touch screen bezels
8.3. Ten-year market forecasts for conductive inks and pastes in value split by touch screen device type
8.4. Ten-year market forecasts for conductive inks and pastes in tonne split by touch screen device type
9.1. Examples of RFID tags
9.2. Typical examples of RFID antennas
9.3. The approximate cost breakdown of different components in a typical UHF RFID tag
9.4. RFID tag figures and ten-year forecasts by application in billion USD
9.5. Cost estimates for making RFID antennas using different production processes
9.6. A Suica transit card widely used in Japan's transport network. The antenna consist of a printed silver conductive track
9.7. Comparing the printing speed, thickness and applications of different printing techniques
9.8. Schematics of different printing processes used in RFID antenna production
9.9. Examples of printed RFID antennas.
9.10. Ten year market forecast for the use of conductive inks in UHF RFID antennas split by ink type.
9.11. Ten year market forecast for the use of conductive inks in HF RFID antennas split by ink type.
10.1. Typical construction and behaviour of piezoresistive force sensors.
10.2. The IDTechEx market and technology roadmap for piezoresistive sensors
10.3. Ten-year market projections for piezoresistive sensors at the device level
10.4. Different glucose test strips on the market.
10.5. The anatomy of a glucose test strip. The working electrode here is carbon based
10.6. Manufacturing steps of a Lifescan Ultra glucose test strip.
10.7. Benchmarking printing vs. sputtering in glucose test strip product. Here, 5 refers to the strongest or highest.
10.8. Printed glucose test trip market.
11.1. Many components in a typical consumer electronics device such as a mobile phone are or can potentially be printed.
11.2. Schematic showing the sales volume of phones.
11.3. The production process using LDS.
11.4. A typical smartphone antenna made using LDS.
11.5. Examples of LDS products on the market.
11.6. The aerosol deposition process and its key features.
11.7. The core components making up an aerosol deposition machine
11.8. Aerosol deposited 3D antennas directly on mobile phone components
11.9. Comparing the LDS vs aerosol processes.
11.10. (left) An antenna dispensing machine and (right) an antenna being printed (dispensed) directly on the phone case.
11.11. Ten-year market projections for the use of conductive inks (silver nano inks) in printing 3D antennas.
12.1. The process starts by printing on a flats or 3D substrate before being thermoformed into a 3D shape.
12.2. Comparison of overhead control panels
12.3. The formation of car overhead consoles using in-mould electronics is a multi-step process.
12.4. These images demonstrate the impact of ink formulation on its performance after being stretched.
12.5. Air conditioning controller unit for a car.
12.6. Examples of thermoformed products made using a CNT-on-PC film
12.7. Increase in resistance as a function of change in length.
12.8. Two prototype examples using PEDOT and CNT
12.9. Example of how in-mould electronics (here referred to as structural electronics) can result in the formation of simple and elegant designs.
12.10. Schematic showing how TactoTek makes its structural or in-mould electronics.
12.11. Ten-year market projections for IME consoles in the automotive sector
12.12. Ten-year market projections for IME conductive inks in the automotive sector.
13.1. Medium-term market projections for smart textiles.
13.2. Some examples of prominent e-textile products are shown in this slide.
13.3. Percentage of e-textile players using each material type
13.4. Microcracks and voids appear in a printed conductive lines under stretch causing it to lose its conductivity.
13.5. Stretchable inks containing only Ag flakes show great resistivity variations under stretch compared to inks containing a distribution of particle sizes.
13.6. Printing a typical conductor on a fabric or textile is currently a four-step process
13.7. Examples of stretchable conductive paste
13.8. Examples of wearable products employing conductive inks.
13.9. Ten-year market projections for stretchable conductive inks in e-textiles.
14.1. Left: example of pre-PCV electronics wit rats nest wiring. Right: example of early PCB.
14.2. Examples of through-hole (left) and SMD PCB (right).
14.3. Schematic using a typical construction of a double-layer (left) and multilayer (right) PCB.
14.4. Breakdown of the PCB market by the number of layers
14.5. Traditional PCBs are a mature technology
14.6. Production steps involved in manufacturing a multi-layer PCB.
14.7. PCB market by production territory
14.8. PCB design files are often sent to the other side of the world to be manufactured and shipped back
14.9. CNC machine create double-sided rigid PCB.
14.10. AgIC have developed a specially-coated PET substrate for inkjetting
14.11. Left: example of a desktop printed single-sided PCB on a plastic (flexible) substrate. Right: example of a Cartesian desktop PCB printer.
14.12. Example of a bot factory machine in the IDTechEx office
14.13. Professional multi-layer desktop PCB printer by NanoDimension
14.14. Example of a multi-layer professional PCB printed using a professional desktop PCB printers.
14.15. Classification and structure of FPCB
14.16. Example of a PCB manufactured using inkjet printed photoresist. Here, printing replaces photolithography
14.17. Comparison of different PCB techniques
15.1. Examples of application that use a transparent conductive layer (glass or film).
15.2. Market forecast for transparent conductive films split by TCF technology
15.3. The sheet resistance requirements scale with the display size.
15.4. Sheet resistance requirements and efficiency of organic photovoltaic.
15.5. Sheet resistance as a function of radius curvature for ITO films. ITO cracks and its sheet resistance goes up when the film is bent.
15.6. Sheet resistance as a function of bending cycle or angle for different TCF technologies such as metal mesh, PEDOT, silver nanowires and carbon nanotubes.
15.7. ITO film price drop from $35/sqm to $18/sqm in a space of two years
15.8. Comparing the market forecast for medium-sized (e.g., AIOs) touch screens pre and post 2012.
15.9. Quantitatively benchmarking different transparent conductive film technologies
15.10. The process flow for making TCFs developed by NanoGrid based in Suzhou
15.11. Printed silver nanoparticle inks and a large touch module
15.12. ClearJet inkjet prints drops of specially formulated silver nano inks, which then self-assemble into a pattern shown above to form a conductive network that is also transparent
15.13. Ten-year market projections for the use of silver nano inks as an ITO replacement material
16.1. Conductive pattern drawn using an ink supplier by Electronics Inks. The pen shown in the photo is the conductive ink that Sakura and Electroninks jointly developed.
16.2. Examples of applications and performance levels of a conductive ink developed by Dream Inks in China.
16.3. Colloidal's ink curing and resistivity
16.4. Example of conductive pattern inkjet-printed using an Epson printed and Colloidal's inks.
16.5. Samsung to replace the etched digitizers with printed ones using silver nanoparticle inks
16.6. Commercial and prototype OLED vs existing (2013 data) LED performance levels
16.7. Examples of LED and OLED lighting installations showing that LED can achieve effective surface emission thanks to the use of waveguides.
16.8. Flexible, thin and light-weight OLED lighting products launched by LG Chem and Konica Minolta.
16.9. Cost projections in $/Klm as a function of year.
16.10. Examples of latest OLED lighting installations in museums, nightclubs, festivals and libraries.
16.11. Ten-year market projections for OLED lighting as a function of year segmented by end application
16.12. Structure of a typical OLED lighting device
16.13. Ten-year market projections for silver nanoinks in OLED lighting applications.
18.1. Properties of the low-melting-point alloy before and after melting (structure and conductivity)
18.2. Electron microscope images of the Napra-developed copper paste (left) and of commercially available resin silver paste (right)
18.3. Resistivity of silver and copper pastes (Commercially available copper pastes: A, B, and C; Napra-developed copper paste: D; and commercially available silver paste: E)
18.4. Resistivity vs. cure temperature for glass-coated silver nanoparticles
18.5. The annealing process and equipment used for Hitachi Chemical's inks and pastes
18.6. Performance of Hitachi Chemical's inks compared to printed circuit board solutions
18.7. The Pulse Forge principle
18.8. Copper pastes developed by Toyobo
18.9. Flexographic formulation of Vor-Ink from Vorbeck
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