Table of Contents
Executive Summary: Optical Interconnects
E.1 Summary of Current Market Drivers and Challenges for Optical Interconnection
E.2 Firms to Watch in this Space
E.2.1 Avago and MicroPOD
E.2.2 CyOptics and Terapics
E.2.3 Finisar, Laserwire and Optical Interconnection
E.2.4 Intel's Light Peak and Silicon Photonics
E.2.5 Luxtera and OptoPhy
E.2.6 Firms Offering Optical Engines and Optical Integration Solutions
E.2.7 Firms Offering Cable, Fiber and Connectors for Optical Interconnects
E.3 Summary of Key Opportunities as Perceived by Technology/Component Suppliers
E.3.1 Optical Engines and Embedded Optical Interconnects
E.3.2 Lasers
E.3.3 Connectors and Cables
E.4 Summary of Forecasts
Chapter One: Introduction
1.1 Background to this Report
1.1.1 Optical Interconnects Defined and Their Newfound Addressable Markets
1.1.2 Optical Integration for Optical Interconnection?
1.2 Objectives of this Report
1.3 Scope of this Report
1.4 Methodology and Information Sources for this Report
1.5 Plan of this Report
Chapter Two: Current and Future Markets for Optical Interconnects
2.1 Processor Speeds and the Need for Optical Interconnects
2.2 Optical Interconnects in Existing High-speed Very-Short-Reach Markets
2.2.1 VSR Telecom and Datacom
2.2.2 Rack-Based Cable Assemblies
2.2.3 Server Clusters
2.2.4 SANs
2.3 Board-level Opportunities for Optical Interconnects
2.3.1 On-board and Board-to-board Communications
2.3.2 Board-to-Board Cable Assemblies
2.3.3 Motherboards and Daughter Boards
2.3.4 Backplanes
2.4 Optical Interconnects in Chip-to-Chip Communications
2.4.1 Market Opportunities in Optical Interconnects in Chip-to-Chip Communications
2.4.2 Optical Interconnects and Multi-core Processors
2.4.3 Optical Interconnects in Transceivers
2.5 Longer-Term Opportunities for Optical Interconnects
2.5.1 On-Chip Optics
2.5.2 Fiber-at-the-Desk and Fiber-to-the-Desk
Chapter Three: Optical Interconnect Products, MSAs and Technologies
3.1 Products for Off-Chip Optical Interconnection
3.1.1 Pre-Terminated Optical Assemblies
3.1.2 Fiber-Optic Jumpers
3.1.3 MPO-based Parallel Optics
3.1.4 AOCs as Optical Interconnects
3.2 How MSAs and Standards are Shaping Optical Interconnection
3.2.1 The Dominant Datacom Standards Environment: Ethernet, Fibre Channel and InfiniBand Breeding New/Updated Transceiver MSAsSNAP12, QSFP, CXP
3.2.2 Optical Interconnection, 300-pin VSR, and OC-768
3.2.3 Optical Interconnection and PCI-Express
3.3 Proprietary Approaches to Optical Interconnection
3.3.1 Light Peak: Future Standard or MSA?
3.3.2 Other Proprietary Approaches
3.4 'Optical Engines' in Optical Interconnection: A New Product Direction?
3.4.1 The Role of Optical Integration in On-Chip and Chip-to-Chip Interconnection
3.4.2 Hybrid Integration Solutions
3.4.3 Future Monolithic Integration Solutions
3.4.4 Optical Interconnection and Novel Laser Types: Silicon and Quantum Dot
Chapter Four: Five-Year Forecasts of Optical Interconnection Markets
4.1 Forecasting Methodology
4.2 Alternative Scenarios
4.3 Forecast of Rack-based Optical Interconnection by Product Type 4.4 Forecast of Board-based Optical Interconnection by Product Type
4.5 Forecast of Chip-to-Chip Optical Interconnection by Product Type
4.6 Timetable and Qualitative Forecast of On-chip interconnection
4.7 Summary of Forecasts for Optical Interconnection
Acronyms and Abbreviations Used in this Report
About the Author
List of Exhibits
Exhibit E-1: Summary of Optical Interconnects Forecast ($ Millions)
Exhibit 1-1: Optical Interconnection Components
Exhibit 2-1: TIA-942 Basic Data Center Topology Defined
Exhibit 2-2: Fiber Channel over Ethernet Illustration
Exhibit 2-3: Avago's MicroPOD Module
Exhibit 3-1: 4-connector End-to-End Fibre Channel Connection
Exhibit 3-2: Harness Assemblies for a Brocade 48000 Switch in a Data Center
Exhibit 3-3: Fiber-Optic Trunk Cable with Pulling Eye
Exhibit 3-4: MPO Connector with Key Up
Exhibit 3-6: Side View Cut-away of Cassette MPO Connection
Exhibit 3-5: MPO Position 1 Designation
Exhibit 3-7: MPO Connector Endface Within Cassette
Exhibit 3-8: TIA-568C Method A Polarity
Exhibit 3-9: TIA-568C Method B Polarity
Exhibit 3-10: TIA-568C Method C Polarity
Exhibit 3-11: SNAP12 Module
Exhibit 3-13: CFP Module
Exhibit 3-12: QSFP Module
Exhibit 3-14: AOC with CXP ends
Exhibit 3-15: Illustration of CXP module and cable (Annex 6, InfiniBand Architecture Specification)
Exhibit 3-16: Today's Supercomputer
Exhibit 3-17: InfiniBand Formats and Data Rates
Exhibit 3-18: Cisco VSR Module with SNAP12 Devices
Exhibit 3-19: PCIe PCB with OE-FPGA from Xilinx/Reflex Phonetics
Exhibit 3-20: Intel Light Peak Technology
Exhibit 3-21: Light Peak Functional Diagram
Exhibit 3-22: MicroPOD Transmitter and Receiver Modules with 12-fiber Ribbon Cable
Exhibit 3-23: Luxtera's OptoPhy Transceiver
Exhibit 3-24: Opportunities for Optical Integration in High-Speed Networks
Exhibit 3-25: New Laser Integrated Products for Parallel Solutions
Exhibit 3-26: Light on Board Technology and LightABLE Sub-Assembly
Exhibit 3-27: CyOptics Terapics Project1 Tbps
Exhibit 3-28: Rendering of 3-D Optical Interconnect
Exhibit 3-29: 1310nm FP Quantum Dot Laser Structure
Exhibit 4-1: Data Center Active Optical Cables
Exhibit 4-2: Rack-based Optical Interconnects Forecast
Exhibit 4-3: MPO-to-LC breakout
Exhibit 4-4: LC-to-LC Jumpers
Exhibit 4-5: Total Revenue of Rack-based Optical Interconnects ($ Millions)
Exhibit 4-6: Board-based Optical Interconnects Forecast
Exhibit 4-7: Chip-to-chip Optical Interconnects Forecast
Exhibit 4-8: Summary of Optical Interconnects Forecast ($ Millions)
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